I. Thin Film Deposition
• RF/DC Sputtering
• Ultrasonicator
• Annealing
II. Lithography
• Mask Aligner and Exposure System
• Wet Bench
III. Electrical Characterization
• Single Channel SMU
• DC Probe Station
IV. Optical Characterization
• Dynamic Light Scattering
• UV - Visible Photospectrometer
V. 3D Printing
• 3D Printer
• Filament Maker
VI. High Energy Ball Milling

RF/DC Sputtering: Rs. 14 Lakhs
Thermal Evaporation: Rs. 4.83 Lakhs

Wet Bench

Magnetic Stirrer

3D Printer (Procurement in Progress)

Annealing Chamber

Photolithography

AICTE - Nano

DSTP - Nano

Dynamic Light Scattering

Electrical Probe System